Qimonda expands DRAM pact with Winbond

news
Aug 30, 20061 min

Qimonda, the world’s second largest DRAM (dynamic RAM) maker, has expanded a technology and production pact with Taiwan’s Winbond Electronics to provide the company with 80-nanometer manufacturing technology.

The deal extends Qimonda’s strategy of sharing its research and development expenses by licensing out chip manufacturing technology to partners such as Winbond, Nanya Technology, and Semiconductor Manufacturing International Corp. of China. The deals also help Qimonda control costs. The company sources chips from these companies, enabling it to rely on them for a steady supply of DRAM without having to spend billions of dollars on new chip factories.

The German company, formerly the memory chip division of Infineon Technologies, will also continue to source chips from Winbond, it said in a statement. The deal extends a partnership begun in 2002, when Infineon agreed to transfer its 110nm technology to Winbond in return for a portion of its output.