Mobile DRAM chip 20 percent thinner than multi-stack package Samsung Electronics Co. Ltd. has developed a thin, low-power 1G-bit chip for portable devices such as cameras, media players and game consoles.The 1Gb Mobile DRAM (dynamic random access memory) chip, which the South Korean manufacturer claim’s is an industry first using 80 nanometer process technology, will start shipping in the second quarter of 2007, the company said Wednesday.The chip has a new temperature-sensing feature that maximizes the self-refresh cycle to reduce power drain in standby mode by 30 percent over conventional memory chip designs, according to Samsung. In addition, the chip is at least 20 percent thinner than a multi-stack package of 512M-bit dies, enabling a single high-density package system of 1.5G-bit or even 2G-bit Mobile DRAM memory, the company said.The new Samsung chip can also be combined with Flash memory via package-on-package designs. Technology IndustrySmall and Medium Business